These laminates are available in either adhesive based or adhesiveless form.
Polyimide copper laminate.
Polyimide laminate thickness 0 05mm polymer thickness 0 025mm backing material 0 009mm copper im301512.
Pyralux fr acrylic based laminates are made with dupont kapton polyimide film and are available in sheet form as single or double sided clads in a wide variety of thicknesses.
Dupont pyralux ap is an all polyimide double sided copper clad laminate that has excellent thermal chemical and mechanical properties.
P96 p26 polyimide based prepreg and laminate isola offers a product line of polyimide based prepreg p26 and core material p96 for high temperature printed circuit applications.
It is ideal for use in rigid flex and multilayer flex applications which require advanced performance such as low dissipation loss for high speed high frequency thermal resistance and high reliability.
Polyimide laminate thickness 0 07mm polymer.
Pyralux ap copper clad laminate dupont pyralux ap is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal chemical and mechanical properties.
High quality polyimide film copper clad laminate for fpc tcp multi layer boards from china china s leading copper clad laminate product market with strict quality control copper clad laminate factories producing high quality polyimide film copper clad laminate for fpc tcp multi layer boards products.
Pyralux fr copper clad laminate.
Slp flexible laminates are available in a broad range of copper clad constructions using a wide variety of base dielectrics.
Dupont pyralux ap is an all polyimide double sided copper clad laminate that has excellent thermal chemical and mechanical properties.
From universal ccls for home electronics semiconductors and network boards to eco friendly halogen free ccls our portfolio boasts an impressive range of products.
Adhesive based clads also known as 3 layer are made using polyimide film and are available in sheet form with either slp fr or lf acrylic.
It is ideal for use in rigid flex and multilayer flex applications which require advanced performance such as low dissipation loss for high speed.
It is ideal for use in rigid flex and multilayer flex applications which require advanced performance such as low dissipation loss for high speed high frequency thermal resistance and high reliability.